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Molybdenum copper alloy – Heat Sink

Heat sink products are widely used in microwave carrier heat sink base, RF device heat sink base, integrated circuit heat sink, semiconductor laser heat sink, optical communication module base, electric vehicle IGBT module heat sink and other fields.

Application area

Heat sink products are widely used in microwave carrier heat sink base, RF device heat sink base, integrated circuit heat sink, semiconductor laser heat sink, optical communication module base, electric vehicle IGBT module heat sink and other fields.


High performance heatspreader products includes WCu, MoCu, CPC, Ag-Dia, Cu-Dia, etc., which maintain high thermal conductivity along with a broad range of thermal expansion coefficients engineered to correspond with a wide variety of applications. Heatspreader products are widely used in microwave carrier heat sink, RF device heat sink, integrated circuit heat sink, semiconductor laser heat sink, optical communication module base, electric vehicle IGBT module heat sink and other fields.


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